发明名称 METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
摘要 A method for manufacturing a flexible printed circuit board is provided to reduce a manufacturing cost and perform a mass production by exposing partially a connector terminal and stacking a plating layer of Au, Sn, Ag or SnPb. A method for manufacturing a flexible printed circuit board includes the steps of: allotting a pattern by patterning a copper metalized film(50); covering a photo-sensitivity material(60) on the whole pattern and exposing a pre-connector terminal(71) partially; completing the connector terminal(70) by allotting a plating layer(72) to the pre-connector terminal(71); exfoliating the photo-sensitivity material(60); conjugating a cover layer film having an opening region corresponding to the connector terminal(70); and completing the manufacture of a flexible printed circuit board by stamping the flexible circuit board centered on the pattern.
申请公布号 KR100655603(B1) 申请公布日期 2006.12.04
申请号 KR20050087368 申请日期 2005.09.20
申请人 DK UIL CO., LTD. 发明人 PARK, BYEONG CHAE;PARK, KI JOON;LEE, YU YONG
分类号 H05K3/24 主分类号 H05K3/24
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