发明名称 |
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD |
摘要 |
A method for manufacturing a flexible printed circuit board is provided to reduce a manufacturing cost and perform a mass production by exposing partially a connector terminal and stacking a plating layer of Au, Sn, Ag or SnPb. A method for manufacturing a flexible printed circuit board includes the steps of: allotting a pattern by patterning a copper metalized film(50); covering a photo-sensitivity material(60) on the whole pattern and exposing a pre-connector terminal(71) partially; completing the connector terminal(70) by allotting a plating layer(72) to the pre-connector terminal(71); exfoliating the photo-sensitivity material(60); conjugating a cover layer film having an opening region corresponding to the connector terminal(70); and completing the manufacture of a flexible printed circuit board by stamping the flexible circuit board centered on the pattern.
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申请公布号 |
KR100655603(B1) |
申请公布日期 |
2006.12.04 |
申请号 |
KR20050087368 |
申请日期 |
2005.09.20 |
申请人 |
DK UIL CO., LTD. |
发明人 |
PARK, BYEONG CHAE;PARK, KI JOON;LEE, YU YONG |
分类号 |
H05K3/24 |
主分类号 |
H05K3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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