APPARATUSES AND METHODS FOR CLEANING A SUBSTRATE

摘要

An apparatus for use in processing a substrate (216) includes a brush enclosure (212) extending over a length. The brush enclosure (212) is configured to be disposed over a surface of the substrate (216) and has an open region that is configured to be disposed in proximity to the substrate (216). The open region extends over the length of the brush enclosure (212) and enables foam (410) from within the brush enclosure (212) to contact the surface of the substrate (216). A substrate cleaning system and method for cleaning a substrate are also described.