| 摘要 |
A laminating apparatus reduced in size and simplified in structure and a laminating method capable of preventing the warpage of a substrate by securing a waiting time after laminating the substrates. A substrate placement parts (1a) are formed along the circumference of a rotating turn table (1). Each of the substrate placement parts (1a) is formed to pass substrate charging positions (11) and (12), a laminating position (13), pre-hardening waiting positions (14a) to (14d), a hardening position (15), a post-hardening waiting position (16), and a discharging position (17) according to the rotation of the turn table (1). After being stuck at the sticking position (13), the substrate is moved through the pre-hardening waiting positions (14a) to (14d) by the rotation of the turn table (1) and left standing for a specified time to eliminate the warpage. |
