摘要 |
<p>Tile bonding process to supports or substrates polymer, which being intended to unite using a tile adhesive on its underside respective polymeric supports, comprises a first stage which takes flamed the polymeric support; a second stage of pre-drying of the tiles at optimal temperature, eliminating any moisture and water least on the lower surface of adhesion tile; and a third stage of adhesive application on at least one of the two sides facing tile and polymeric supports. Tile bonding process to supports or substrates polymer, which being intended to unite using a tile adhesive on its underside respective polymeric supports, comprises a first stage which takes flamed the polymeric support; a second stage of pre-drying of the tiles at optimal temperature, eliminating any moisture and water least on the lower surface of adhesion tile; a third stage of adhesive application on at least one of the two sides facing tile and polymeric supports; a fourth stage where the sets are placed tile and polymer support, respective bases of support so static for any length of time polymerization of the adhesive holding also a constant pressure; and a fifth step of drying sets tile and polymer support during at least a time span of 2 hours at a given temperature. An independent claim is adhesive used in bonding process tiles to support or polymeric substrates, essentially where a product is two component, epoxy-polyamino amide formed by two compounds.</p> |