| 摘要 |
A UV curing apparatus and method is provided for efficiently decreasing the curing time for the curing of a UV curable product, article or other object having a UV curable coating, ink or adhesive by at least one array of UV LED chips on a substrate. Advantageously, the UV LED chips are driven at a current ranging from (2) to (4) times higher (EX. 3.6 Amps.) than the normal operating current (Ex. 1.2 Amps.) for the UV LED chips to cause the UV LED chips to emit UV light at a much greater intensity (y-axis of graph) than when the UV LED chips are driven at their normal operating current. For enhanced results, the UV LED chips are cooled during operation of the apparatus and system, so that the UV LED chips can be driven at a higher current for a longer period of time. |
