发明名称 IMAGE PICKUP DEVICE FOR DIE BONDER
摘要 <P>PROBLEM TO BE SOLVED: To attain highly precise two-dimensional and three-dimensional image recognition by a stereo vision by a plurality of cameras in a die bonder. <P>SOLUTION: A shift-lens optical system is configured by vertically arranging a plurality of cameras 3 and 4 on the substrate for allocating chips 1 in parallel at the upper part of the conveyance path of a carrier 2 such as a frame or tape so that their optical axes can be made vertical to the conveyance path. The image pickup regions of those cameras 3 and 4 are overlapped on the conveyance path, and the image of the bonding region of the carrier 2 moving to the overlapped image pickup region is recognized by stereo vision. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006324599(A) 申请公布日期 2006.11.30
申请号 JP20050148480 申请日期 2005.05.20
申请人 CANON MACHINERY INC 发明人 KOTO ATSUSHI;YAMAMOTO TAKAKO
分类号 H01L21/52;H05K13/08 主分类号 H01L21/52
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