| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip component in which degradation in characteristics is suppressed by forming a predetermined circuit pattern precisely. SOLUTION: The chip component comprises a square element 11 produced by curing photosensitive resin, a circuit pattern 12 buried in the element 11, and an electrode 13 arranged on the lower surface of the element 11. The circuit pattern 12 buried in the element 11 is a coil 14 of spiral metal having an end connected with an electrode 13 through a via 15. The circuit pattern 12, the electrode 13, and the via 15 are formed by plating and the vias 15 are arranged in a zigzag manner. COPYRIGHT: (C)2007,JPO&INPIT
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