| 摘要 |
A multilayer chip-type triplexer is provided. It uses four-session matching transmission lines to integrate three band-pass filters at different frequency bands for simplifying triplexer design. A band-pass filter may be composed of a two-stage combline band-pass filter. The transmission zero generated by the two-stage combline band-pass filter is to increase the isolation and performance of the triplexer. The triplexer uses low-loss materials to reduce the insertion loss of the circuit Moreover, a multilayer structure is adopted to minimize the size of the triplexer. The triplexer is applicable to multiband radio-frequency modules, and meets the multimodule requirement for wireless communication products.
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