| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a specific compound-containing thermosetting resin composition for sealing a light emitting diode. <P>SOLUTION: The light emitting diode sealing resin composition has two or more groups represented by a formula (1), äR<SP>1</SP>is an allyl group or a methallyl group, A<SP>1</SP>is a group composed of a bivalent carboxylic acid} and contains a compound where a group represented by a formula (2) serves as a repetitive unit. The formula (2) is that äA<SP>2</SP>is a group composed of a bivalent carboxylic acid or an acid anhydride, X is derived from a compound containing an aromatic ring and two or more hydroxyl groups and provided with the formula (1) as an end group by ester bonding, and the A<SP>2</SP>can have a branching structure where a group represented by the formula (2) is made to serve as a repetitive unit}. <P>COPYRIGHT: (C)2007,JPO&INPIT |
