| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having more solder balls than usual mounted through the use of small solder balls for improving the layout of the solder balls. SOLUTION: In the semiconductor device having the solder balls 7 mounted on an interposer 6, the solder balls of a smaller size than specified in the standard are highly densely mounted on a solder ball electrode on a circuit wire drawn on a solder ball mounting surface of the interposer. COPYRIGHT: (C)2007,JPO&INPIT
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