| 摘要 |
A chip package and the wire bonding process thereof are provided. The chip package includes a circuit substrate, a chip, a bonding wire, and a leaning block, wherein the circuit substrate has a bonding surface and at least one contact disposed on the bonding surface. In addition, the chip is disposed on the bonding surface of the circuit substrate, wherein the chip has an active surface facing opposite to the circuit substrate and at least one bonding pad disposed on the active surface. Furthermore, the leaning block is disposed on the contact. The bonding wire connects the bonding pad and contact and passes over the leaning block. The chip package and the wire bonding process thereof can prevent the bonding wire from drooping and thus avoid bridging to other lines on the circuit substrate. The processing yields can be improved accordingly.
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