发明名称 |
Apparatus and method using stackable substrates |
摘要 |
An embodiment of the present invention provides an apparatus, comprising a plurality of stacked substrates, wherein the substrates are capable of accepting surface mounted components (SMCs) and wherein the plurality of stacked substrates are separated and connected by the surface mounted components (SMC) or solder balls or both.
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申请公布号 |
US2006267174(A1) |
申请公布日期 |
2006.11.30 |
申请号 |
US20060349500 |
申请日期 |
2006.02.06 |
申请人 |
MACROPOULOS WILLIAM;MENDOLIA GREG;KHAYO IZZAC |
发明人 |
MACROPOULOS WILLIAM;MENDOLIA GREG;KHAYO IZZAC |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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