| 摘要 |
<p>The invention concerns a method for treating a substrate made of a material comprising wood wherein the two following steps a) and b) are combined: a) contacting said substrate with an aqueous solution of at least one water-soluble hydrophilic organic compound, whereby said hydrophilic compound penetrates into the cell wall of the wood; b) carrying out the following three successive steps: b1), b2) and b3): b1) optionally drying said substrate; b2) contacting said substrate with at least one polymerizable and/or crosslinkable hydrophobic organic compound, whereby said compound penetrates into the porosity of the wood; b3) polymerizing and/or crosslinking said polymerizable and/or crosslinkable hydrophobic compound inside the porosity of the wood. The invention also concerns a substrate made of a material comprising wood, said substrate comprising in the porosity of the wood at least 40 %, preferably more than 50 %, more preferably above 60 %, by volume of a polymerized and/or crosslinked compound and 1 to 30 % by volume of a hydrophilic compound such as PEG in the cell wall and the porosity of the wood.</p> |
