ION BEAM SPUTTERING SYSTEM FOR MOLD & DIE AND THE METHODE

摘要

A grinding system capable of having several mum of a grinding depth per unit time when grinding a surface of a material with high bond energy by an ion beam by maintaining a large current ion beam of scores of mA and a large current ion beam with energy of tens of keV for mold surface grinding, and a grinding method using the same are provided. A system for grinding a surface of a mold by ion beam sputtering comprises: a surface grinding part comprising an ion source unit(1) for generating an ion beam, an ion beam optical unit(2) mounted on a lower part of the ion source unit and composed of a solenoid coil for uniform ion beam grinding, a three-dimensional mold jig unit which is mounted on a lower part of the ion beam optical unit, and which can be transferred up and down and side to side, declined and rotated to process a predetermined shape during ion beam processing, and a vacuum unit(3) in which the three-dimensional mold jig unit is mounted, and which maintains a degree of vacuum required in an ion beam surface grinding process; an ion source controlling power supply part(4) for supplying a controlled power supply to the surface grinding part; and a three-dimensional mold jig unit/vacuum unit control part(5) for controlling the vacuum unit. The system further comprises transfer means(6) mounted on lower portions of the surface grinding part, the ion source controlling power supply part and the three-dimensional mold jig unit/vacuum unit control part.