发明名称 MEMORY MODULE, MEMORY SYSTEM AND INFORMATION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a memory system that includes a convenient large capacity ROM and RAM. <P>SOLUTION: The memory system includes a nonvolatile memory, a cache memory, a control circuit and an information processor. For high speed, data in the nonvolatile memory is transferred to and retained in the cache memory. The data transfer from the nonvolatile memory to the cache memory involves error corrections to provide improved reliability. The information processor can access the cache memory and the nonvolatile memory independently to provide improved convenience. The memory system comprising the plurality of chips is configured as a memory system module in which the chips are stacked and wired by a ball grid array (BGA) and chip bonding. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006323739(A) 申请公布日期 2006.11.30
申请号 JP20050147957 申请日期 2005.05.20
申请人 RENESAS TECHNOLOGY CORP 发明人 MIURA SEISHI
分类号 G06F12/06;G06F12/08 主分类号 G06F12/06
代理机构 代理人
主权项
地址