| 发明名称 |
RESIN COMPOSITION |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition which is improved in the heat resistance and water absorption with suppressing the degradation in the processability. SOLUTION: The polyamide resin composition comprises an aromatic polyamide resin and an epoxy group-containing phenoxy resin having the epoxy group in the molecule, characterized by containing 30-50% by mass of the above epoxy group-containing phenoxy resin. COPYRIGHT: (C)2007,JPO&INPIT
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| 申请公布号 |
JP2006321951(A) |
申请公布日期 |
2006.11.30 |
| 申请号 |
JP20050148388 |
申请日期 |
2005.05.20 |
| 申请人 |
NITTO SHINKO KK;E I DU PONT DE NEMOURS & CO;DU PONT TEIJIN ADVANCED PAPER KK |
发明人 |
KIHARA YASUYUKI;TAKAHASHI YOSHIKI;TAKAYAMA HIDENORI;IMAI MASANORI;TANAKA YASUNORI;NARUSE SHINJI;ANDERSON DAVID WAYNE |
| 分类号 |
C08L77/00;C08L63/00;C08L71/08 |
主分类号 |
C08L77/00 |
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