| 摘要 |
A device ( 10 ) is provided for matching the CTE between substrates ( 12, 14 ), e.g., a semiconductor substrate and packaging material. The first substrate ( 12 ) has a first coefficient of thermal expansion and the second substrate ( 14 ) has a second coefficient of thermal expansion. At least two layers ( 16 ) of liquid crystal polymer are formed between the first substrate ( 12 ) and the second substrate ( 14 ), each layer having a unique coefficient of thermal expansion progressively higher in magnitude from the first substrate ( 12 ) to the second substrate ( 14 ).
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