| 摘要 |
A wiring board includes: a flexible insulating base 1 ; a plurality of conductive wirings 2 arranged on the flexible insulating base 1 ; protruding electrodes 3 provided respectively at an end portion of the same side of each of the conductive wirings; external terminals 4, 5 formed respectively at the other end portions of each of the conductive wirings; metal plating layers applied on the conductive wirings, the protruding electrodes and the external terminals; and solder resist layers 7 formed respectively by coating the conductive wirings in regions between the end portions at which the protruding electrodes are provided and the external terminals. In the regions where the solder resist layers are formed, no metal plating layers are formed on the conductive wirings, and the surfaces of the conductive wirings to be contacted with the flexible insulating base are rougher than the surfaces not to be contacted with the flexible insulating base. Even when a film base is thin, bending stress applied to the conductive wirings is relieved sufficiently, and thus breaks in the wirings are suppressed. |
