首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Integrated circuit package with air gap
摘要
An integrated circuit (IC) package comprises an IC wafer comprising a circuit. A "C"-shaped layer is arranged adjacent to the substrate and that creates an air gap between the "C"-shaped layer and the circuit of the IC wafer.
申请公布号
US2006267170(A1)
申请公布日期
2006.11.30
申请号
US20060487077
申请日期
2006.07.14
申请人
发明人
SUTARDJA SEHAT
分类号
H01L23/02
主分类号
H01L23/02
代理机构
代理人
主权项
地址
您可能感兴趣的专利
SITUATIONAL MARKING AND AWARENESS TAG (SMART) BEACON, SYSTEM AND METHOD
Light-emitting diode chip on a GaN basis and method for producing a light-emitting diode component with a light-emitting diode chip on a GaN basis
A well comprising a safety mechanism and sensors
Hearing aid with a device for reducing a microphone noise and method for reducing a microphone noise
Nucleation efficiency of talc in the foaming behaviour and cellular structure of polymer based foams
INTER-DEVICE SESSION CONNECTIVITY ENHANCEMENT
Ultrasonic injection molding on a web
IMPROVED REDOX COUPLE FOR ELECTROCHEMICAL AND OPTOELECTRONIC DEVICES
HIGH-VOLUME FLUID DISPENSE SYSTEM
FIXING SYSTEM FOR CABLES, IN PARTICULAR IN WIND TURBINES
Method for pulsed charging of a battery in a standalone system comprising a supercapacitor
POLARIZER AND LIQUID CRYSTAL DISPLAY COMPRISING ACRYLIC PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS
Transient decay amperometry
System having blade segment with curved mounting geometry
SYSTEM AND METHOD FOR EXTRUDING PARTS HAVING MICROSTRUCTURES
CONSTELLATION MAPPING METHOD
Methods and organisms for the growth-coupled production of 1,4-butanediol
RECOMBINANT MICROORGANISMS AND USES THEREFOR
POROUS STRUCTURES FOR ENERGY STORAGE DEVICES
Enhancing Quality of Ultrasound Image in an Ultrasound System via image filtering