| 摘要 |
PROBLEM TO BE SOLVED: To provide a dispensation nozzle capable of coating a substrate surface with an adhesive with uniform thickness when adhering a semiconductor element and a slid-state image pickup element to a substrate. SOLUTION: There is provided a discharge part 16 having a cylindrical barrel 16a of the dispensation nozzle 11 discharging an adhesive to the substrate W and an opening 16c discharging an adhesive along the center axis of the barrel part, and a smaller diameter part than the diameter of the barrel part is formed at the top end part 16b of the side discharging the adhesive of the discharge part. COPYRIGHT: (C)2007,JPO&INPIT
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