发明名称 MULTI-LAYERED COMPLEMENTARY WIRE STRUCTURE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a multi-layered complementary wire structure capable of sharply reducing the resistance of wire and to provide a manufacturing method of the multi-layered complementary wire structure. SOLUTION: The multi-layered wire structure comprises: a substrate; a plurality of first conductive lines formed in a first layer over the substrate extending in parallel to each other in a first direction; a plurality of second conductive lines formed in a second layer over the first layer extending in parallel to each other in a second direction orthogonal to the first direction; a plurality of sets of third conductive lines formed in the second layer extending in the first direction, each set of third conductive lines corresponding to one of the first conductive lines; and a plurality of sets of conductive paths formed between the first layer and the second layer, each set of conductive paths corresponding to one of the first conductive lines and one set of third conductive lines and electrically connecting the corresponding first conductive line to the corresponding set of third conductive lines. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006323333(A) 申请公布日期 2006.11.30
申请号 JP20050291275 申请日期 2005.10.04
申请人 IND TECHNOL RES INST 发明人 CHEN YU-CHENG;CHEN CHI-LIN
分类号 G09F9/30;G02F1/1362;H01L21/302;H01L21/31;H01L21/3205;H01L21/461;H01L21/469;H01L21/8242;H01L23/053;H01L23/12;H01L23/52;H01L23/522;H01L29/786 主分类号 G09F9/30
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