发明名称 PROCESS FOR MANUFACTURING CHIP COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a chip component in which degradation in characteristics is suppressed by forming a predetermined circuit pattern precisely. SOLUTION: The chip component comprises a square element 11 produced by curing photosensitive resin, a circuit pattern 12 buried in the element 11, and an electrode 13 arranged on the lower surface of the element 11. The circuit pattern 12 buried in the element 11 is a coil 14 of spiral conductor having an end connected with an electrode 13 through a via 15. A conductor layer 10 containing carbon is arranged on the upper surface of the element 11, light transmittance of the conductor layer 10 is differentiated from that of the element 11, and the conductor layer 10 is employed as an image recognition pattern for judging the orientation of the element 11. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006324461(A) 申请公布日期 2006.11.30
申请号 JP20050146249 申请日期 2005.05.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORIMOTO SHINICHI;TAOKA MIKIO;OBA MICHIO;MATSUTANI SHINYA
分类号 H01F27/29;H01F17/00;H01F17/02;H01F27/00 主分类号 H01F27/29
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