| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering device of which heating capacity is improved. SOLUTION: The reflow soldering device heats a printed board 4 with mounted electronic components by hot air blowing out from a plurality of hot air jetting pipes 13 in a heating zone 3, while the printed board 4 is being conveyed by a conveyor 5 within a furnace 1 provided with a plurality of zones 3, 6 and 18. The hot air on the printed board 4 blowing out from the pipes 13 to the printed board 4 is 6 m/sec or higher in velocity on the printed board 4, and the velocity of hot air on the printed board 4 blowing out from the pipes 13 to the printed board 4 is made lower toward the inlet of a first heating zone 3 around the inlet thereof. The velocity of hot air on the printed board 4 is preferably made lower even around the outlet of the first heating zone 3 or in partitioning sections 2 partitioning the zones. COPYRIGHT: (C)2007,JPO&INPIT
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