DEVICE AND METHOD FOR WORKING LEAD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a lead working apparatus with which a punch can be extracted from a punching hole in a state where an unnecessary punching piece which is caused when an unnecessary part of a lead in a semiconductor device is punched by the punch is securely detached from a tip part of the punch. SOLUTION: An absorption board 8 which vacuum-absorbs the unnecessary punching piece 3a of the lead 3, which is punched by the punch 4, is arranged below a die 5. The absorption board 8 can freely laterally move to an absorption position C where the unnecessary punching piece 3a is absorbed and a removal position where the unnecessary punching piece 3a is removed by saving it from the absorption position C. The absorption board 8 has an absorption port 9 confronted with a lower part of the punching hole of the die 5 in the absorption position C. The punch 4 is constituted in such a way that it pushes out the unnecessary punching piece 3a in the punching hole to a lower part of the die 5 and presses it to the absorption port 9 when the unnecessary part of the lead 3 is punched. COPYRIGHT: (C)2007,JPO&INPIT