发明名称 LIQUID COOLING SYSTEM SUITABLE FOR REMOVING HEAT FROM ELECTRONIC COMPONENTS
摘要 A liquid cooling system ( 30 ) for removing heat from a heat-generating component is disclosed. The liquid cooling system includes a heat-absorbing member ( 50 ) defining therein a fluid flow channel ( 54 ) for passage of a coolant. The fluid flow channel includes a plurality of passage segments ( 54 a, 54 b, 54 c) arranged from a center portion to a peripheral portion of the heat-absorbing member. Every two adjacent passage segments are in fluid communication with each other in such a manner that, when the coolant flows from one passage segment to enter into an adjacent passage segment, the coolant is divided into at least two currents flowing in different directions in the adjacent passage segment.
申请公布号 US2006266498(A1) 申请公布日期 2006.11.30
申请号 US20060306914 申请日期 2006.01.16
申请人 LIU TAY-JIAN;LEE CHIH-PENG 发明人 LIU TAY-JIAN;LEE CHIH-PENG
分类号 H05K7/20 主分类号 H05K7/20
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