| 摘要 |
An apparatus for transferring a semiconductor wafer is provided to simplify constitution and structure of the apparatus to readily assemble the apparatus. An apparatus for transferring a semiconductor wafer includes a first transferring part and a second transferring part. The first transferring part includes a guide main body(10), a support frame, and a center finger. The support frame is reciprocally installed at the guide main body. The center finger is supported by the support frame. The second transferring part includes a base(51), a drive device, a ball screw(31), a guide member(33), a lever(40), a plurality of slide members(61,62,63,64), a plurality of connecting members, and a plurality of drive fingers. The guide member is engaged with the ball screw. The lever is in surface contact with the guide member.
|
