NEW POLYIMIDE PRECURSOR AND UTILIZATION THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a polyimide precursor applicable to a rigid or an FPC (flexible printed circuit) substrate and imidizable at low temperatures.

SOLUTION: The polyimide precursor comprises a polyimide structure composed of a tetravalent organic acid and mainly of an aromatic diamine and a polyimide precursor structure composed of the tetravalent organic acid and an aliphatic diamine and imidizable at ≤200°C. A photosensitive resin composition comprises the polyimide precursor and an acrylic or a methacrylic compound.

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