| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a lead frame of a non-lead type for BGA and LGA that is capable of applying the manufacturing method of the lead frame by a conventional photo-etching process, and has high reliability corresponding to high density-mounting without deteriorating manufacturing efficiency. SOLUTION: A resist pattern 21a and a resist pattern 21b are formed on both surfaces of a metal base material 11. Both surfaces of the material 11 are etched with the pattern 21a and the pattern 21b as masks to form a penetrated section 31 and a half-etched (thin) region 32. Blackening treatment is performed on the material 11 to form an oxide film 41 on the side of the metal base material in the section 31 and the region 32. Exfoliation treatment is performed on the pattern 21a and the pattern 21b to form a gold plating film 71 at a predetermined position of the lead by a mask plating process, thereby obtaining the lead frame. COPYRIGHT: (C)2007,JPO&INPIT |
