| 摘要 |
A method of forming a circuit board having first and second conductive layers with a dielectric layer, or of forming a capacitor having a dielectric layer in a circuit board with first and second conducting layers, may include forming a first interstice in the first conductive layer, forming a second interstice engaging the first interstice in the second conductive layer, and inserting the dielectric layer between the first and second interstices.
|
