| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing occurrence of kink or distortion of a wiring board even if a stiffener is omitted. <P>SOLUTION: The semiconductor device comprises a wiring board, a semiconductor chip which is flip-chip bonded to the wiring board, and a heat spreader bonded to the rear surface of the semiconductor chip, with a gap provided between a protruding part around the chip of the heat spreader and the upper surface of wiring board. The wiring board comprises a plurality of insulating substrates provided with through-holes having different diameters, with each insulating substrate including a glass cloth. <P>COPYRIGHT: (C)2007,JPO&INPIT |
