| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate where a light emitting element is mounted on a bottom of a cavity, a sealing resin filled into the cavity is held as difficult to be peeled, and can efficiently reflect the light from the light emitting element. <P>SOLUTION: The wiring substrate 1 includes a substrate body 2 which is composed of a plurality of ceramic layers (insulating layer) s1-s3 and has a surface 3 and a back 4, and a cavity 5 which has an opening on the surface 3 of the substrate body 2, a bottom 6, and an inclined side 7. A side metal layer 8 is formed on the side 7 of the cavity 5, the uppermost ceramic layer s3 forming the surface 3 of the substrate body 2 expands from the upper edge of side 7 of the cavity 5 to the center of opening of the cavity 5, the back metal layer 10 formed on the back 9 opposed to the surface 3 of insulating layer s3 of the uppermost layer is in contact with the upper edge of the side metal layer 8, and a metal plated layer 11 is continuously formed on the back metal layer 10 and the side metal layer 8. <P>COPYRIGHT: (C)2007,JPO&INPIT |
