PACKAGING SUBSTRATE MODULE AND ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a packaging substrate module and its manufacturing method capable of having superior inductance, and to provide a semiconductor device. SOLUTION: A semiconductor substrate 2 provided with an inductor 4 on one surface and a circuit board 1 are connected through bumps 3, and a plate-type magnetic body 5 is arranged between the inductor 4 of the semiconductor substrate 2 and the circuit board 1. COPYRIGHT: (C)2007,JPO&INPIT