发明名称 METHOD FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENT, AND SCREEN PRINTING PLATE FOR FORMING INTERNAL ELECTRODE OF LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated electronic component, and a screen printing plate for forming internal electrodes of the laminated electronic component by which high accuracy in cut position can be obtained by preventing oozing and swelling when cut sensing marks are screen-printed. SOLUTION: The internal electrodes 2a and the cut sensing marks 3 are simultaneously formed on a ceramic green sheet 1 by the screen printing. A mother laminated body is obtained by laminating the ceramic green sheet. After that, the outer periphery of the mother laminated body is cut and the cut sensing marks 3 are exposed on its cross-section. The mother laminated body is cut into chip-like laminated bodies on the basis of the exposed cut sensing marks. In the cut sensing marks, the cut sensing mark whose longitudinal direction is formed in the direction orthogonal to the squeezing direction of the screen printing, is composed of a plurality of mark pieces 3a divided in the longitudinal direction via air gap parts 3b. A plurality of rows of the cut sensing marks with the mark pieces 3a are arranged in parallel in the squeezing direction of the screen printing. The mark pieces 3a adjacent in the squeezing direction are arranged in zigzag so that their adjacent air gap parts 3b are not overlapped with each other. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006324538(A) 申请公布日期 2006.11.30
申请号 JP20050147517 申请日期 2005.05.20
申请人 MURATA MFG CO LTD 发明人 IZEKI YUTAKA;OKUYAMA SHINGO
分类号 H01G4/12;H01G4/30;H01G13/00 主分类号 H01G4/12
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