| 摘要 |
PROBLEM TO BE SOLVED: To provide a small and high performance chip coil at a low cost by coloring one surface of wiring to prevent the irregular reflection from the wiring surface upon exposure. SOLUTION: By coloring one surface of the wiring 102, unnecessary curing (or fogging) of a photosensitive resist due to the irregular reflection from the wiring 102 can be prevented even when the wiring 102 is formed using via etc. in a multilayer form, while embedding the wiring 102 in the cured photosensitive resist 108, so that the refinement and the higher precision of the wiring 102 of the chip coil or a via 104 are enabled and the miniaturization and higher performance of the product are enabled. COPYRIGHT: (C)2007,JPO&INPIT
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