| 摘要 |
PROBLEM TO BE SOLVED: To simply provide a highly reliable film substrate for wiring that is suitable for transmitting a high-frequency signal, and enables high-density mounting. SOLUTION: The manufacturing method of the film substrate for wiring includes a conductor thin-film forming step in which a conductor seed layer 3 of a conductor thin-film is formed on the surface of a liquid crystal polymer film 1 of a thermoplastic resin film by a non-electrolytic plating method via a Pd catalyst 2, and a heat crimping step for thermally crimping the liquid crystal polymer film 1 in which the conductor seed layer 3 is formed by the conductor thin-film forming step, and the conductor seed layer 3 at a temperature lower than a melting point while applying shearing forces in the film face direction to them. COPYRIGHT: (C)2007,JPO&INPIT
|
