| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for producing a printed wiring board used in various electronic apparatus in which the circuit pattern and solder resist can be formed with extremely excellent alignment accuracy. SOLUTION: Since heat treatment at a temperature of glass transition point or above of a substrate is performed after forming resist in a process following a process for forming a circuit pattern, solder resist can be formed under a state of good dimensional stability of the substrate and thereby the circuit pattern and solder resist can be formed with extremely excellent alignment accuracy. COPYRIGHT: (C)2007,JPO&INPIT
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