| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip capable of using a pad by bonding only the pad to be used among two or more pads, and to provide a semiconductor device. SOLUTION: A semiconductor chip 100 comprises a first pad 1, a second pad 2, an input buffer 3 connected to the pad 1 and the second pad 2, and a circuit block connected to the input buffer 3. Based on a first input signal inputted from the first pad 1, and a second input signal inputted from the second pad 2, the input buffer 3 chooses the first input signal, and inputs it into a circuit block 4. COPYRIGHT: (C)2007,JPO&INPIT
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