CONDUCTIVE PASTE AND WIRING BOARD USING IT

摘要

Conductive past used when a wiring circuit is formed on a board, and a wiring board obtained by using the conductive paste. Since conductive paste formed by scattering metal powder and glass frit into an organic vehicle is spread onto a board by screen printing or the like and then is dried and sintered to be able to form a good-conductivity wiring circuit, it is widely used in electronic apparatus components. This paste poses problems that high contents of metal powder and glass frit with respective to the entire conductive paste will increase the viscosity of the conductive paste, for example, decrease the discharge amount of conductive paste through openings in a screen printing plate at screen printing, and that low contents will increase shrinkage at drying and sintering. The above problems are resolved by conductive paste having the above contents of at least 85 wt.%, and a viscosity of 100 through 400Pa·s when measured with an E type rotary viscosimeter at 25°C at a rotation speed of 1 rpm.