Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung

摘要

Component comprises a substrate; an organic light emitting diode arranged on the substrate; and an encapsulation produced using a thin layer process. An independent claim is also included for a process for encapsulating an electronic or micro-electronic component using a plasma source which is pulsed or is a remote or after-glow process. Preferred Features: A vaporized metallic layer is used to encapsulate the component.