METHOD AND APPARATUS FOR REDUCING SURFACE DEFECTS IN MICROSTAMPS

摘要

A removal assembly and method for removing a submaster from a master is described. A curved tooling surface is arranged within a housing of the assembly. A first array of vacuum cups is attached to the housing adjacent a first end of the curved tooling surface, where the first array of vacuum cups are configured to provide a vacuum grip on a first portion of the submaster. A second array of vacuum cups is attached to the housing adjacent a second end of the curved tooling surface, where the second end opposes the first end, the second array of vacuum cups is configured to provide a vacuum grip on a second portion of the submaster. A rotation mechanism is configured to rotationally support the master as the master is rolled along the curved tooling surface to remove the submaster.