发明名称 |
Verfahren zum Betreiben einer Anordnung aus einem elektrischen Bauelement auf einem Substrat und Verfahren zum Herstellen der Anordnung |
摘要 |
In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. The connecting area of the contact lug and the contact area of the component are interconnected so that at least one zone of the contact lug protrudes beyond the area of the component. The contact lug is provided with at least one electrically conducting film while the electrically conducting film is provided with the electrical connecting area of the contact lug. The arrangement is particularly useful for large-area, low-inductive contacting of power semiconductor chips, as it allows for high current density. |
申请公布号 |
DE10314172(B4) |
申请公布日期 |
2006.11.30 |
申请号 |
DE2003114172 |
申请日期 |
2003.03.28 |
申请人 |
INFINEON TECHNOLOGIES AG;SIEMENS AG |
发明人 |
AUERBACH, FRANZ;GUTSMANN, BERND;LICHT, THOMAS;SELIGER, NORBERT;WEIDNER, KARL;ZAPF, JOERG |
分类号 |
H01L23/485;H01L21/60;H01L23/12;H01L23/498;H01L23/538;H01L23/552;H01L23/66 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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