| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent electronic components from being mounted on an area depending on the number of modules to be stacked. <P>SOLUTION: This multilayer module is a component-incorporated module where a resin layer 39 covering an electronic component 2a at one side of a circuit substrate 1, connection terminals 34a and 34b provided on this resin layer 39 and the other side of the circuit substrate 1 and a through-hole 46 connecting the both sides of a module 32 are all built in advance. A module 33 employs a module with connection terminals 35a and 35b formed at the positions corresponding to the above connection terminals 34a and 34b, a through-hole 47 formed in advance to connect the above connection terminals 35a and 35b and an electronic component 2b, and an insulated layer 36 formed between the conductive layers 34 and 35 is provided with a conductive adhesive 37 for connecting the connection terminals 34a and 34b and those 35a and 35b, respectively. In this way, the positions of the through-hole 47 and an electronic component 2c are not restricted by the position of the through-hole 46 in the module 33. <P>COPYRIGHT: (C)2007,JPO&INPIT |
