| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method capable of obtaining a solid-state imaging device having improved connection reliability. <P>SOLUTION: The method of manufacturing a solid-state imaging device includes a process in which a pair of lead frames each having a rectangular outer frame, a lead integrally formed with the outer frame within its frame and a projection formed on one side surface of the frame are connected on the surfaces of both ends of a long metallic substrate in the projection to form a composite lead frame in which the lead is separated from the surface of the metallic substrate; a process in which an insulation resin is supplied into a mold hosing the composite lead frame, the insulation resin is filled into a gap between the surface of the metallic substrate and the lead, and one part of the composite lead frame is molded so that a junction portion between the outer frame and the lead may be exposed outward, thereby forming an external frame body; a process in which a long solid-state imaging element is mounted on the composite lead frame having the outer frame body formed thereon; and a process in which the junction portion exposed outside of the outer frame is separated. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
