| 摘要 |
PROBLEM TO BE SOLVED: To prevent a relative position between a land and an application region of solder from being shifted, and to prevent a land area from being changed, even if a bonding position of a coverlay shifts. SOLUTION: In a flexible printed wiring board 1 to which a coverlay 3 is bonded while a land 4 is formed, the land 4 is composed of a principal plane 7 on which cream solder is printed and an enlargement 8 whose width is formed to be narrower than the width of the principal plane 7. With respect to the coverlay 3, there is formed an opening 9 for outwardly turning each of the principal planes 7 and the enlargement 8. COPYRIGHT: (C)2007,JPO&INPIT
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