| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning apparatus capable of more surely preventing a foreign material removed from a contact face of a bonding head from being fallen off on a circuit board. SOLUTION: The cleaning apparatus 10 for the boding head for cleaning a suction face 18b on which the bonding head 8 for bonding an electronic component onto the circuit board is in contact with the electronic component is provided with a cover member 34b for covering at least part of the circuit board, and configured to be relatively movable to the bonding head 8. COPYRIGHT: (C)2007,JPO&INPIT
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