| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame and a surface-mounting circuit substrate using the lead frame wherein, when subjecting the circuit substrate to a reflow processing, no reflow jig for supporting the lead frame is required, and there are made possible the reduction of the manufacturing cost of the circuit substrate, the simplification of the work of the reflow processing, and the efficient operation of a reflow furnace. SOLUTION: In the lead frame 6 comprising a tie bar 7 and a lead group 9 tied to the tie bar 7, the leads of the lead group 9 are selected properly as a plurality of joining leads 10 for joining them by solders to the lands present on the circuit substrate, as supporting leads 11 disposed on both the sides of the joining leads 10, for so supporting by bending them backward as to make the lead frame 6 self-sustained, and as a positioning lead 12 for so inserting it into a positioning hole bored in the circuit substrate as to position the lead frame 6 on the circuit substrate. COPYRIGHT: (C)2007,JPO&INPIT
|
