发明名称 HEAT SINK, AND PACKAGING COMPONENTS INCLUDING THE SAME
摘要 PROBLEM TO BE SOLVED: To enable simple removal of a heat sink from a circuit component. SOLUTION: A pedestal 12 holds a plurality of first fins (fin 11-a to fin 11-l) with a predetermined width and at least one of second fins (fin 11-m to fin 11-q) with a width narrower than that of the first fin at a predetermined interval, with the side faces on one side being aligned. The pedestal 12 has a substantially cylindrical rotary shaft 121 on the side of a plane X. By pushing up an end b of a rodlike lever 13 rotatably mounted via the rotary shaft 121, the heat sink 10 is removed from the thermally connected circuit component 20. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006324470(A) 申请公布日期 2006.11.30
申请号 JP20050146402 申请日期 2005.05.19
申请人 TOSHIBA CORP 发明人 HORIOKA MASAHIRO
分类号 H01L23/40;H05K7/20 主分类号 H01L23/40
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