发明名称 |
METHODS FOR FORMING ARRAYS OF SMALL, CLOSELY SPACED FEATURES |
摘要 |
Methods of forming arrays of small, densely spaced holes or pillars for use in integrated circuits are disclosed. Various pattern transfer and etching steps can be used, in combination with pitch-reduction techniques, to create densely-packed features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer. |
申请公布号 |
WO2006127586(A2) |
申请公布日期 |
2006.11.30 |
申请号 |
WO2006US19710 |
申请日期 |
2006.05.22 |
申请人 |
MICRON TECHNOLOGY, INC.;ABATCHEV, MIRZAFER;SANDHU, GURTEJ |
发明人 |
ABATCHEV, MIRZAFER;SANDHU, GURTEJ |
分类号 |
H01L21/033 |
主分类号 |
H01L21/033 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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