SOLID-STATE IMAGING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a solid-state imaging device having reliability of connection between bonding pads and bonding wires.

SOLUTION: This solid-state imaging device 1 is provided with a long metallic substrate 16; a long solid-state imaging element 4 fixed on the surface of the metallic substrate 16 via an adhesive layer 18; and bonding pads 6 formed on the surface of the solid-state imaging element 4 and electrically connected to a lead frame via the bonding wires 14. The adhesive layer 18 includes a first adhesive layer 18a and a second adhesive layer 18b having an elasticity higher than that of the first adhesive layer 18a, and the metallic substrate 16 is fixed with the solid-state imaging element 4 via the second adhesive layer 18b in a region immediately below the bonding pads 6 provided on both ends of a longitudinal direction of the solid-state imaging element 4.

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