| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid imaging device which can make the quality of a product favorable after assembling. <P>SOLUTION: The solid imaging device has a package provided with a chamfering part wherein the solid imaging device is stored. The chamfering part of the package is formed such that, when the package and other parts are engaged, a position where the package and the other part can be brought into surface-contact at beginning is chamfered. <P>COPYRIGHT: (C)2007,JPO&INPIT |
